| Epoxy Resin Specifications Technical | Indlela yokuPakisha | Isicelo | |||||||||||||
| Umzekelo | Umbala | Ifom | Umxholo oqinileyo (%) | EEW (g/eq) | Inqaku lokuthambisa (℃) | Chromaticity (G/H) | Viscosity (mPa·s) | I-Hydrolyzable Chlorine (ppm) | Umxholo weBromine (%) | Umxholo wePhosphorus (%) | Isampulu | ||||
| Bisphenol F Epoxy Resin | Umgangatho we-bisphenol F uhlobo lwesisombululo se-Epoxy resin | EMTE160 | Ayinambala ukuya UKhanya Mthubi | Ulwelo | - | 155-165 | - | H≤20 | 1200-1600 | ≤150 | - | Igubu lentsimbi:240kg/drum IBC package: 1000kg ISO tank package:22tons | Iingubo ezingena-solvent-free, i-castings, i-adhesives, izinto zokugquma kunye nezinye iindawo. | ||
| EMTE170 | Ayinambala | 165-175 | G≤1 | 3500-4500 | ≤100 |  | |||||||||
| Uhlobo lwe-bisphenol F olulungisiweyo lwesisombululo se-Epoxy resin | EMTE 207K70 | Umthubi oKhanyayo ukuya koBomvu | 70±1.0 | 500-600 | G＜8 | ＜3000 | ＜500 | - | Ukupakishwa kwegubu lentsimbi: 220Kg. | Iibhodi zesekethe eziprintiweyo, i-electronic copper clad laminates, i-adhesives, izinto ezidibeneyo, i-laminates zombane kunye nezinye iindawo zemveliso. | |||||
