| Iinkcukacha zobugcisa zeResin eziPhakathi kunye neeSpecialty Resin | ||||||||||||||||
| Udidi | Imodeli | Umbala | Ifomu | HEW (g/eq) | Indawo yokunyibilika (℃) | Indawo yokuthambisa (℃) | I-Chromaticity (G/H) | Ukuqina kweCone-Plate (P) | I-Phenol yasimahla (ppm) | Ubunyulu (%) | Isampulu | Indlela Yokupakisha | Isicelo | |||
| Abaphakathi | I-Phenolic Resin | IBisphenol A I-Phenolic Resin | I-EMTP322 | Akukho mbala ukuya kumbala otyheli-mdaka okhanyayo | Iqinile | - | - | 114-119 | G≤0.8 | 60-90 | ≤2000 | - |  | Ingxowa yephepha ene-PE liner yangaphakathi: 25 kg/ingxowa. | Ii-epoxy resin intermediates okanye ii-curing agents zisetyenziswa kakhulu kwi-electronic copper clad laminates, kwi-semiconductor packaging nakwezinye iindawo. | |
| Isiseko I-Phenolic Resin | PF-2123 | Ukusuka kumbala ophuzi okhanyayo ukuya kumbala obomvu omdaka | 100-105 | G: 12-14 | - | ≤4 |  | Ingxowa yephepha ene-PE liner yangaphakathi: 25 kg/ingxowa. Ingxowa yetoni: 500kg/ingxowa | Izinto zokuqhobosha kunye nezinto zokungqubana ezifana neebrake pads zoololiwe, iimoto kunye neebhayisekile, umgubo we-bakelite weemveliso zombane, izinto zokuncamathelisa zebhalbhu zezibane, amavili okusila i-resin kunye nezinto ezingagugiyo zerabha zokusila nokusika, izinto zokuncamathelisa isanti zokubumba, izinto ezithintela ilangatye, njl. | |||||||
| i-ortho-Cresol I-Phenolic Resin | I-EMTP210 | Umbala ophuzi okhanyayo | 113-115 | G≤3 | 35-45 | 1000 | - | Ingxowa yephepha ene-PE liner yangaphakathi: 25 kg/ingxowa. | Ii-epoxy resin intermediates okanye ii-curing agents zisetyenziswa kakhulu kwi-electronic copper clad laminates, kwi-semiconductor packaging nakwezinye iindawo. | |||||||
| I-TPN Tetraphenolethane I-Phenolic Resin | I-EMTP110 | Ntsundu | 90-110 | 135-145 | G≤18 | - | ≤1000 | - | I-epoxy resin ephakathi okanye i-ejenti yokuphilisa. | |||||||
| IBisphenol F | I-EMTP120 | Ukusuka kumhlophe ukuya kubomvu mdaka | - | ≥105 | - | G<0.8 | 1000 | ≥88 | - | Izinto eziphakathi ezifana nee-epoxy resins eziphantsi kwe-viscosity, ii-polycarbonate resins, ii-polyphenylene ether resins kunye nee-polyester ezingagcwaliyo, kwaye zinokusetyenziselwa ukwenza izinto ezithintela ilangatye, ii-antioxidants kunye nee-plasticizers. | ||||||
| I-DCPD I-Phenolic Resin | I-EMTP100 | Umdaka obomvu | 150-210 | - | 100-110 | G≤13 | ≤1000 | - | - | I-laminate ye-elektroniki egqunywe ngekopolo kunye nezinye iindawo. | ||||||
| Iinkcukacha zobugcisa ze-EMTMD8700 Phosphazene Flame Retardant | ||||||||||||||||
| Udidi | Imodeli | Umbala | Ifomu | Indawo yokunyibilika (℃) | Umxholo oguquguqukayo (%) | I-Td5% (℃) | Umxholo wePhosphorus (%) | Umxholo weNitrogen (%) | Isampulu | Indlela Yokupakisha | Isicelo | |||||
| I-Phosphazene Flame Retardant | I-EMTM8700 | Umhlaba Omhlophe ukuya Kumthubi Okhanyayo | Iqinile Umgubo | 104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | - | Ingxowa yephepha ene-PE liner yangaphakathi: 25 kg/ingxowa. | Iilaminate ezigqunywe ngekopolo, iglu yokubumba nge-elektroniki, izinto zokugquma ezisebenzayo, iiplastiki ezithintela ilangabi kunye neminye imizi-mveliso. | |||||
| Iinkcukacha zobugcisa zeBismaleimide | ||||||||||||||||
| Udidi | Imodeli | Umbala | Ifomu | Indawo yokunyibilika (℃) | Ixabiso le-asidi (mgKOH/g) | Ukunyibilika | Isampulu | Indlela Yokupakisha | Isicelo | |||||||
| I-Bismaleimide | Ibanga le-elektroniki | I-EMTE505 | Mthubi oMhlophe | Iqinile Umgubo | ≥155 | ≤1 | Inyibilika ngokupheleleyo | - | Ingxowa yephepha edityanisiweyo okanye ipakethe yebharele yephepha enefilimu, eyi-25kg ngebhegi/ngebharele. | Izixhobo zokwakha ze-aerospace, iindawo zokwakha ezimelana nobushushu obuphezulu be-carbon fiber, ipeyinti yokufunxa emelana nobushushu obuphezulu, ii-laminates, ii-laminates ezigqunywe ngekopolo, iiplastiki ezibunjiweyo, iibhodi zesekethe eziprintiweyo zodidi oluphezulu, izinto ezimelana nokuguguleka, izincamathelisi zamavili okugaya idayimani, izinto zemagnethi, izinto ezithungwayo nezinye izinto ezisebenzayo kunye nezinye iindawo zobugcisa obuphezulu. | ||||||
| Ibanga loMbane | D929 | Mthubi Mthubi-Mhlophe | ≥155 | ≤1 | Inyibilika ngokupheleleyo | - | ||||||||||
