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Umboneleli weHlabathi woKhuseleko lweNdalo

Kwaye uKhuseleko lweZixhobo eziNtsha zeZixhobo

I-MDI Modified Epoxy Resin

I-MDI modified epoxy resin yi-isocyanate modified epoxy ene-oxazolidinone efakwe kwikhonkco eliphambili, enokumelana nobushushu kunye nokuguquguquka okuhle. Le mveliso ifumaneka ingenaBoron kwaye ineBoron, iyanyibilika kwizinyibilikisi eziqhelekileyo ezifana nepropylene glycol methyl ether, i-acetone, i-butanone, njl. Ihambelana kakuhle ne-dicyandiamide, i-phenolic curing agent, kwaye ifanelekile kwi-laminate field engenalo i-lead-free copper clad.


Iinkcukacha zobugcisa ze-MDI Modified Epoxy Resin Indlela Yokupakisha Isicelo
  Imodeli Umbala Ifomu Umxholo Oqinileyo
(%)		 EEW
(g/eq)		 Indawo yokuthambisa
(℃)		 I-Chromaticity
(G/H)		 Ukuqaqamba
(mPa·s)		 I-Hydrolyzable Chlorine
(ppm)		 Umxholo weBromine
(%)		 Umxholo wePhosphorus
(%)		 Isampulu
I-resin ye-epoxy eguqulweyo ye-MDI I-resin ye-epoxy eguqulweyo ene-brominated I-EMTE8204 Umbala oMthubi oMhlophe ukuya kuMbomvu oMhlophe Ulwelo 74-76 335-365 - G:7-13 300-1000 - 16.5-18   - Idrama yentsimbi: 220kg/idrama Iibhodi zesekethe eziprintiweyo ezithintela ilangatye, iibhodi ze-elektroniki ezigqunywe ngobhedu, ukupakishwa kwe-capacitor, ii-laminates zombane kunye nezinye iindawo zemveliso.
- I-EMTE8205 Umbala omdaka okhanyayo ukuya kotyheli omdaka Iqinile - 280-320 65-75 - - - - Ingxowa yephepha ene-PE liner yangaphakathi: 25 kg/ingxowa. Ii-substrates zesekethe eziprintiweyo ezingenalo i-halogen, ii-laminates ze-elektroniki ezigqunywe ngobhedu, ukupakishwa kwe-capacitor, ii-laminates zombane kunye nezinye iindawo zemveliso.
I-EMTE
8205CK75		 Umbala oMthubi ukuya kumbala obomvu omdaka Ulwelo 74-76 280-320 - G:8-12 500-2500 ≤500 - Idrama yentsimbi: 220kg/idrama

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