IBanga | Thermal | Iimpawu eziphambili |
3025 | E-105℃ | Ukunganxibi |
3240 | B-130℃ |
|
3253 | H-180℃ | Amandla aphezulu omatshini aphantsi kwetemp.,i-halogen-free |
D326 | H-180℃ | Amandla aphezulu omatshini aphantsi kwetemp |
D333 | C-200℃ | Amandla aphezulu omatshini aphantsi kwetemp |
3242 | F-155℃ |
|
D327 | F-155℃ | Ukugcinwa kwamandla aphezulu obushushu, i-V-1 |
D328 | F-155℃ | Ukugcinwa kwamandla aphezulu obushushu, i-V-0, i-UL, i-benzoxazine resin |
DF204 | F-155℃ | Ukugcinwa kwamandla aphezulu obushushu, i-V-0, i-UL, i-epoxy resin |
D331 | H-180℃ | Ukugcinwa kwamandla aphezulu obushushu, i-V-0, i-UL, i-benzoxazine resin |
D329 | H-180℃ | PTI ≥ 500V, V-0,halogen-free |
D338 | H-180℃ | V-0 |
D330 | B-130℃ | I-semi-conductive, emnyama |
D339 | F-155℃ | I-semi-conductive, emnyama |
D350A | H-180℃ | Ukugcinwa kwamandla aphezulu obushushu |
EPGC201 / 202 | B-130℃ | I-G10 / FR4 ( UL ) |
EPGC203 / 204 | F-155℃ | I-G11 / FR5 ( UL ) |
EPGC205 | F-155℃ | Ilaphu elilukiweyo elilula leglasi |
EPGC306 | F-155℃ | CTI ≥ 500V |
EPGC307 | F-155℃ | I-CTI ≥ 500V,Ilaphu lokuluka elilula leglasi |
EPGC308 | H-180℃ | Ukumelana okuphezulu emva kokuntywiliselwa emanzini |
DF3316A | C-200℃ | Ukumelana nobushushu obuphezulu |
DF336 | F-155℃ | CTI ≥ 600V, V-0,halogen-free |
IBanga | Thermal | Iimpawu eziphambili |
D332 | F-155℃ | Ukunganxibi |
D3524A | F-155℃ | Umnyama, i-flame retardant, amandla aphezulu |
DF3524B | F-155℃ | Ubuninzi obuphantsi, ukubuyiswa komlilo, kusetyenziswe njengento engundoqo |
D325 | - | Kevlar anti-stab board,Ukhuseleko lokhuseleko |
D295 | - | Prepreg. yelaphu leKevlar kwizigcina-ntloko ze-ballistic, Ukhuseleko lokhuseleko |
D332 | F-155℃ | Ukunganxibi |
G3849 | H-180℃ | Ifakwe kwizixhobo ze-cryogenic (iqondo lobushushu eliphantsi ukuya -196℃) |
D3849 | F-155℃ | Ifakwe kwizixhobo ze-cryogenic (iqondo lobushushu eliphantsi ukuya -196℃) |
I-Z3849 | B-130℃ | Ifakwe kwizixhobo ze-cryogenic (iqondo lobushushu eliphantsi ukuya -196℃) |
DF3313L | B-130℃ | ingxinano ephantsi, inobunzima obuncinci, Iphepha elihle lokufakwa kwe-thermal |
DF3314O | F-155℃ | ingxinano ephantsi, inobunzima obuncinci, Iphepha elihle lokufakwa kwe-thermal |
Amalungu omatshini ayenziwe ikakhulu nge-SMC, BMC, UPGM203 (GPO-3) prepreg, EPGC202 (FR4) kunye nezinye izinto eziluhlaza ngokucofa okushushu okanye i-epoxy resin/epoxy vinyl resin/unsaturated polyester resin pultrusion forming.
Ifiber eyongeziweyo enobungakanani obukhethekileyo obusekwe kwifiber eyomeleziweyo
Isebenza kumbane wokuvelisa amandla ashushu (ukwenziwa kombane wenkunkuma kamasipala, ukuvelisa amandla erhasi yenkunkuma)
Ukusebenza | Iyunithi | Imilinganiselo | |
1 | Ukugoba Amandla(esiqhelo) | MPa | ≥210 |
2 | Amandla okugoba ngokuthe nkqo (160℃±2℃) | MPa | ≥170 |
3 | Amandla oxinzelelo | MPa | ≥320 |
4 | Tensile strength | MPa | ≥270 |
5 | Ukumelana ne-AC Voltage | V/60s | 6000 |
Ukusebenza | Iyunithi | Imilinganiselo | |
1 | Ukugoba Amandla | MPa | ≥400 |
2 | Amandla okuqina (okuthe nkqo) | MPa | ≥300 |
3 | Amandla ombane athe nkqo laminar (90℃ ioli) | MV/m | ≥16.1 |
4 | CTI | V | ≥500 |
Ukusebenza | iyunithi | Imilinganiselo | |
1 | Ukugoba amandla | MPa | ≥400 |
2 | Uxinzelelo Amandla nkqo laminar | MPa | ≥300 |
3 | Umothuko we-Thermal 320℃/1h | __ | Akukho de-lamination, iqamza, resin flow |
4 | CTI |
| ≥50 |